MPI Chuck Systems
For different requirements, MPI offers a variety of:
- mmW and
- High-power Chucks
- from ambient temperatures through -60°C up to 300°C.
Dedicated top surfaces with vacuum holes, gold plating or a surface manufactured with pure isolation material are example of the available options. Creative thinking and technical expertise sets MPI designs apart and are based upon what is actually required for the specific application.
Features & Benefits
ERS Integrated Technology (IT)
Wafer probing at different temperatures continues to be a significant challenge. MPI is working together with ERS to provide unified software and hardware integration of thermal chucks in all MPI Engineering Probe Systems…
The thermal controller touch screen panel is seamlessly integrated into MPI’s TS150, TS200, TS300, TS2000, TS2000-SE probe systems and provides extremely convenient operation and also minimizes the test cell foot print.
ERS patented AC3 cooling technology incorporated
These chucks incorporate the ERS patented AC3 cooling technology and its air management system to purge the MPI ShieldEnvironment™ directly from “already used” air – reducing dry air consumption up to 30 to 50% as compared to other systems on the market.
All MPI RF chucks include two auxiliary chucks built with ceramic material for accurate RF calibration.
High thermal stability probe platen
All MPI 300 °C systems include a dedicated high thermal stability probe platen to achieve optimal contact quality regardless of temperature range.
Three key and notable benefits incorporated into MPI thermal solution are:
- Ultra-low noise chuck performance inside the shielded MPI TS200-SE and TS2000-SE systems,
- High systems reliability.
- Leverage air-cooled chiller performance to safe CDA consumption,
- Superior electrical isolation for High Power applications up to 10 kV.
In case of interest for environmental heating and cooling temperature testing system, please visit MPI Thermal Test division.