Automated Test over Multiple Temperatures ATMT™
True to our mission of making complex probe station operation as intuitive as possible, minimizing training costs, and continuously focusing on reducing cost of test, MPI designed unique and cost-effective technologies, that enable Automated Test over Multiple Temperatures ATMT™. In combination with MPI’s WaferWallet® or WaferWallet®MAX , Device Modeling and Wafer Level Reliability engineers will benefit from these features to generate significant more measurement data. It shortens the time-to-market for new product developments, offering a competitive advantage for our customers, where they can react faster to market changes and always be one step ahead of their competitors.
Features & Benefits
For DC over temperature measurements, Device Modeling and Wafer Level Reliability engineers are commonly using Celadon’s, high temperature, low leakage probe card. MPI and Celadon are finally offering leading edge, complete measurement solutions, enabling Automated Test over Multiple Temperatures ATMT™ DC at wide temperature range: -60…300°C.
For the case of a few measurements performed with MicroPositioners, MPI has developed thermally stable Kelvin probes that allow Automated Test over Multiple Temperatures ATMT™ at -40 to 175°C.
MPI’s SmartCarrier™ uniquely combines different materials that automatically compensate for the lateral expansions of the RF probes without the need for complex software or programmable MicroPositioners*.
SENTIO®‘s new patent-pending ContactSense™ image processing can determine the new contact positions on-the-fly with an accuracy of a few micrometers, completing MPI’s Automated Test over Multiple Temperatures ATMT™ RF.
* One programmable MicroPositioner is recommended for automated RF calibration by using QAlibria®