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MPI Chuck Systems

MPI Chuck Systems

Wafer Chuck

For different requirements, MPI offers a variety of:

  • Coaxial,
  • Triaxial,
  • RF,
  • mmW and
  • High-power Chucks

from ambient temperatures through -60°C up to 300°C. 

Dedicated top surfaces with vacuum holes, gold plating or a surface manufactured with pure isolation material are example of the available options. Creative thinking and technical expertise sets MPI designs apart and are based upon what is actually required for the specific application.

Features & Benefits

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ERS Integrated Technology (IT)

Wafer probing at different temperatures continues to be a significant challenge. MPI is working together with ERS to provide unified software and hardware integration of thermal chucks in all MPI Engineering Probe Systems. The new Integrated Technology (IT) is responsible for unsurpassed:

  • Measurement results,
  • Less maintenance
  • Best in class thermal characteristics:
    • Fastest transition time
    • Better system flatness
    • Excellent thermal distribution over the entire temperature range.

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MPI & ERS AirCool® PRIME Technology

Together MPI Corporation and ERS electronic GmbH designed the New 300 mm Thermal Chuck AirCool® PRIME Technology family, offering unsurpassed thermal flexibility with reduced soaking time by 60%, and the largest variety of thermal ranges on market.

The systems can be configured with lower temperature starting points of -60°C, -40°C, -10°C, 20°C or 30°C and at the higher end points at 200°C or 300°C – all this in order to tailor the thermal capability to a different requirements and budgets. PRIME™ technology can test at -10°C without a chiller or at -40°C using a very small chiller making the systems extremely cost-effective in order to reduce the overall cost of test.

Reduced transition time, improved electrical performance, easier testing under inert-gas atmosphere, and field upgradability are additional values of the AirCool® PRIME thermal chuck systems.

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Thermal Controller

The thermal controller touch screen panel is seamlessly integrated into MPI’s TS150, TS200,  TS200-SE, TS300TS2000, TS2000-SE, TS3000 and TS3000-SE probe systems and provides extremely convenient operation and also minimizes the test cell foot print.

Probe Cards | MicroPositioners | Wafer Chuck | Wafer Probe | Wafer Probing | Failure Analysis | Design Validation

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ERS Patented AC3 Cooling Technology Incorporated

These chucks incorporate the patented AC3 cooling technology and self-management system to purge the MPI ShielDEnvironment™ using recycled cooling air, thus drastically reducing air consumption 30% to 50% as compared to other systems on the market.

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Auxiliary Chucks

All MPI RF chucks include two auxiliary chucks built with ceramic material for accurate RF calibration. 

High Thermal Stability Probe Platen

All MPI 300 °C systems include a dedicated high thermal stability probe platen to achieve optimal contact quality regardless of temperature range.

Three key and notable benefits incorporated into MPI thermal solution are:

  • Ultra-low noise chuck performance inside the shielded MPI TS200-SE and TS2000-SE systems,
  • High systems reliability.
  • Leverage air-cooled chiller performance to safe CDA consumption,
  • Superior electrical isolation for High Power applications up to 10 kV.

In case of interest for environmental heating and cooling temperature testing system, please visit MPI Thermal Test division.