Wafer Chucks | Cold Chuck | 300mm Wafer Chucks | Wafer Chuck | Thermal Chucks | 150mm Chucks 

Wafer Chucks | 200mm Wafer Chuck | 300mm Wafer Chucks | Thermal Chuck | Cold Chucks | Thermal Chuck  


Wafer Chucks | Wafer Chuck System |  Coaxial Chucks | Thermal Chuck | Wafer Chucks | Cold Chucks

AUX Chucks | High Power Wafer Chuck |  Hot Chucks | High Power Wafer Chuck | Wafer Chucks | Temperature Chucks

Wafer Chuck Systems | Thermal Chuck |  Triaxial Chucks | Wafer Chuck System | Wafer Chucks | Thermal Chuck

MPI Chuck Systems


For different requirements, MPI offers a variety of:

  • Coaxial,
  • Triaxial,
  • RF,
  • mmW and
  • High-power Chucks

from ambient temperatures through -60°C up to 300°C. 

Dedicated top surfaces with vacuum holes, gold plating or a surface manufactured with pure isolation material are example of the available options. Creative thinking and technical expertise sets MPI designs apart and are based upon what is actually required for the specific application.

Features & Benefits

ERS Integrated Technology (IT)

Wafer probing at different temperatures continues to be a significant challenge. MPI is working together with ERS to provide unified software and hardware integration of thermal chucks in all MPI Engineering Probe Systems. The new Integrated Technology (IT) is responsible for unsurpassed:

  • Measurement results,
  • Less maintenance
  • Best in class thermal characteristics:
    • Fastest transition time
    • Better system flatness
    • Excellent thermal distribution over the entire
      temperature range.
MPI Chuck Systems with ERS Integrated Technology (IT)

MPI & ERS AirCool® PRIME Technology

Together MPI Corporation and ERS electronic GmbH designed the New 300 mm Thermal Chuck AirCool® PRIME Technology family, offering unsurpassed thermal flexibility with reduced soaking time by 60%, and the largest variety of thermal ranges on market.

The systems can be configured with lower temperature starting points of -60°C, -40°C, -10°C, 20°C or 30°C and at the higher end points at 200°C or 300°C – all this in order to tailor the thermal capability to a different requirements and budgets. AirCool® PRIME technology can test at -10°C without a chiller or at -40°C using a very small chiller making the systems extremely cost-effective in order to reduce the overall cost of test.

Reduced transition time, improved electrical performance, easier testing under inert-gas atmosphere, and field upgradability are additional values of the AirCool® PRIME thermal chuck systems.


Thermal Controller

The thermal controller touch screen panel is seamlessly integrated into all MPI’s probe systems and provides extremely convenient operation and also minimizes the test cell foot print.

Chuck Systems Thermal Controller

ERS Patented AC3 Cooling Technology Incorporated

These chucks incorporate the patented AC3 cooling technology and self-management system to purge the MPI ShielDEnvironment™ using recycled cooling air, thus drastically reducing air consumption 30% to 50% as compared to other systems on the market.

ERS Patented AC3 Cooling Technology Incorporated

Auxiliary Chucks

All MPI RF chucks include two auxiliary chucks built with ceramic material for accurate RF calibration. 


High Thermal Stability Probe Platen

All MPI 300 °C systems include a dedicated high thermal stability probe platen to achieve optimal contact quality regardless of temperature range.