Hot Chucks | Wafer Chuck System | Temperature Chucks | Triaxial Wafer Chuck | Thermal Chucks | Temperature Chucks
Temperature Chucks | Cold Chuck | Cold Chucks | Triaxial Wafer Chuck | Wafer Chucks | Temperature Chucks
Wafer Chucks | Triaxial Chuck | 300mm Wafer Chucks | Temperature Chuck | Coaxial Chucks | Coaxial Chucks
Coaxial Chucks | 300mm Wafer Chuck | 300mm Wafer Chucks | Wafer Chuck System | Coaxial Chucks | Thermal Chucks
MPI Chuck Systems
For different requirements, MPI offers a variety of:
- mmW and
- High-power Chucks
from ambient temperatures through -60°C up to 300°C.
Dedicated top surfaces with vacuum holes, gold plating or a surface manufactured with pure isolation material are example of the available options. Creative thinking and technical expertise sets MPI designs apart and are based upon what is actually required for the specific application.
Features & Benefits
ERS Integrated Technology (IT)
Wafer probing at different temperatures continues to be a significant challenge. MPI is working together with ERS to provide unified software and hardware integration of thermal chucks in all MPI Engineering Probe Systems. The new Integrated Technology (IT) is responsible for unsurpassed:
- Measurement results,
- Less maintenance
- Best in class thermal characteristics:
- Fastest transition time
- Better system flatness
- Excellent thermal distribution over the entire
MPI & ERS AirCool
® PRIME Technology
Together MPI Corporation and ERS electronic GmbH designed the New 300 mm Thermal Chuck AirCool
The systems can be configured with lower temperature starting points of -60°C, -40°C, -10°C, 20°C or 30°C and at the higher end points at 200°C or 300°C – all this in order to tailor the thermal capability to a different requirements and budgets. AirCool
Reduced transition time, improved electrical performance, easier testing under inert-gas atmosphere, and field upgradability are additional values of the AirCool
The thermal controller touch screen panel is seamlessly integrated into all MPI’s probe systems and provides extremely convenient operation and also minimizes the test cell foot print.
ERS Patented AC3 Cooling Technology Incorporated
These chucks incorporate the patented AC3 cooling technology and self-management system to purge the MPI ShielDEnvironment™ using recycled cooling air, thus drastically reducing air consumption 30% to 50% as compared to other systems on the market.
All MPI RF chucks include two auxiliary chucks built with ceramic material for accurate RF calibration.
High Thermal Stability Probe Platen
All MPI 300 °C systems include a dedicated high thermal stability probe platen to achieve optimal contact quality regardless of temperature range.