MPI High Power Probe Systems
10 kV – 600 A
MPI High-Power device characterization systems are specifically designed for on-wafer high power device testing. These systems support up to 3 kV triaxial / 10 kV coaxial and 600 A (pulsed) accurate measurements while providing a low-noise, fully shielded test environment.
High Power Probe System Solutions
Manual high power systems provide flexibility and cost-effective solutions for research institutes, universities, and foundries that need complex and accurate device characterization but not require to do high volume measurements. These systems are designed to connect with advanced high power measurement instruments to support advanced research works, without compromising the usability, safety and the measurement accuracy up to 3 kV (triax) / 10 kV (coax) and 600 A (pulsed).
TS2000-DP is designed for open and flexible measurement set up with supporting over temperature measurement up to 300°C. Its open platen design makes it possible to upgrade system for voltage higher than 10 kV, in the future and hence provide value for your investment.
TS2000-HP and TS3000-HP comes with MPI ShielDEnvironment™, providing wide temperature range from negative temperature as low as -60°C to higher temperature of 300°C and ultra-low-noise measurement capability in addition.
MPI High Power Technologies
High Voltage, High Current and Ultra-High Power Probes
MPI high power probing solutions include dedicated high voltage, and high current probes, which use MPI propriety multi-contact tips for reduced contact resistance. MPI’s high voltage probes are capable of low leakage current measurements during high voltage tests up to 3 kV triaxial or 5 kV & 10 kV coaxial set-ups. In addition, MPI Ultra-High-Power probes provides solution for on wafer measurement of ultra-high power devices up to 10kV/600A.
Proprietary Triaxial Chuck Connection
MPI’s proprietary triaxial connector offers very easy reconfiguration between, ultra-low noise 3kV triaxial and 10kV coaxial set-ups without any changes to the chuck connection.
High Power Chucks
The MPI ambient or ERS AirCool® thermal Chucks supports wide-range of temperature from -60°C to 300°C are manufactured with low contact resistance and gold plated chuck tops. The chucks are fully integrated assemblies and are capable of holding wafers as thin as 70 µm. Users can configure high power chucks to support Taiko wafer types.
Regulatory approved, all MPI high power systems are configured with a safety interlock enabled dark box or an infrared laser light curtain design to provide a safe testing environment.
MPI High Power Selection Guide
|Ambient and Thermal Chucks|
Max. 600A (pulsed)
|TAIKO Wafer Support|
|Safety Protection & Interlock|
|Anti-Arcing Probe Card|
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