MPI Announced TITAN™ Multi-Contact Probe for RF IC Characterization

Advanced Semiconductor Test

New

MPI Corporation introduces the TITAN™ Multi-Contact Probe, the further advances of company’s TITAN™ RF probing technology for challenges of testing modern Si RF ICs.

TITAN™ Multi-Contact Probe Online Design Capture Form

Advanced Semiconductor Test

New

Request for quote now! – Use Online Design Capture Form to build your probe by choosing RF signal (S), logic (L) and power supply (P) channels according to your IC pad layout.

New 300 mm Fully-Automatic Probe Systems Series with WaferWallet™

Advanced Semiconductor Test

New

MPI introduces the fully-automatic TS3500 probe station series, configurable with unique MPI WaferWallet™ for simple and convenient handling of multiple wafer types and sizes.

The 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD)

May 19 – 23, 2019

Advanced Semiconductor Test

Shanghai Marriott Hotel Parkview, Shanghai, China

Booth A1

Event

Space Tech Expo 2019

May 20-22, 2019

Thermal Test

Pasadena Convention Center, California, USA

Booth No. 4027

Event

Semiconductor Wafer Test Workshop

June 2 – 5, 2019

Probe Card Technologies

Rancho Bernado Inn, San Diego, CA, USA

Booth No. 25

Event

IEEE MTT-S International Microwave Symposium 2019

June 4 – 6, 2019

Advanced Semiconductor Test | Thermal Test

Boston Convention and Exhibition Center, MA, USA

Booth No. 742

Event

93rd ARFTG Microwave Measurement Conference

June 7, 2019

Advanced Semiconductor Test

The Westin Boston Waterfront, Boston, MA, USA

Event

Centre for Power Electronics Annual Conference 2019

July 3 – 4, 2019

Advanced Semiconductor Test

Holywell Park Conference Centre, Loughborough University, UK

Booth No. 742

Event

previous arrow
next arrow
Slider