150毫米探測台 | 300 mm晶圓探測 | 晶圓探針台 | 手動探針系統 | 手動晶圓探測器 | 150毫米探測台 | 手動晶圓探針台 

MPI TS150, TS200 & TS300

MPI TS150, TS200 & TS300

Probe System | Probe Station | 300mm Probe Station | 300mm Probing System | Manual Probe System

MPI TS150, TS200 & TS300 each incorporate many exciting features which make daily operation much simpler.  The features are easy, intuitive, convenient and ensure highly accurate measurements.

Features & Benefits

150mm Probe Station - Probe System - Wafer Probe Station

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Air-Bearing Stage

The MPI unique air-bearing stage design, with simple single-handed puck control, provides unsurpassed convenience of operation for fast XY navigation and quick wafer loading without compromising accurate and fine positioning capability with the additional fine and accurate 25x25mm XY-Theta micrometer movement.

MPI Unique Platen Lift | Probe System | Probe Station | 200mm Probe Station | 200mm Probing System | Manual Probe System

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Unique Platen Lift
with Probe Hover Control™

Measurement accuracy depends on the contact quality first! The highly repeatable (1µm) platen lift design with three discrete positions for contact, separation (300µm), and loading (3mm) with a safety lock utility are all examples of unparalleled functionality incorporated into MPI manual probe systems. These features prevent unexpected probe or wafer damage while providing intuitive control and accurate contact positioning. This capability is especially critical in both high frequency and high power applications in order to achieve the most accurate measurement results.

For TS200 and TS300, additional Probe Hover Control™ comes with hover heights (50, 100 or 150 µm) for easy and convenient probe to pad alignment.

Unique Chuck Z Control | Wafer Chuck | Thermal Chuck | Hot Chuck | Cold Chuck | HotChuck

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Height Adjustment Scale

The probe platen has 25 mm of fine height adjustment required to support various applications. The unique 1mm accurate scale gives direct feedback about the current position.

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Compact and Rigid Platen Design

The compact and rigid platen design accommodates up to ten DC or four RF MicroPositioners for various application requirements.

Various Chuck Options | Wafer Chuck | Thermal Chuck | Hot Chuck | Cold Chuck | Semiconductor Wafer Chuck

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Various Chuck Options

The manual systems are available with various chuck options to meet different budgets and application requirements. Chuck options include MPI’s coaxial or triaxial Chucks or various ERS thermal chucks to support temperature measurement up to 300 °C – as example for seamless integration of the thermal touch controller for quick and convenient access and operation.

Auxiliary Chucks | Wafer Chuck | Thermal Chuck | Hot Chuck | Cold Chuck | Semiconductor Wafer Chuck | RF Chuck | Ambient Chucks

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Auxiliary Chucks

The RF chucks include two auxiliary chucks built in ceramic material for accurate RF calibration.

High Magnification Microscopes for RF

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Various Optic and Movement Choices

A wide range of Optics is available with a choice between stereo for all common DC/CV applications or single tube high magnification microscopes for RF or load-pull configurations.

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Optic Tilting

90 degree tilting as a standard feature or even pneumatically driven, linear Z lift offers very convenient set-up and easy probe tips replacement.

Probe to pad contact | Probe Systems | Manual Probe Systems | Manual Probe Stations | 150mm Probe Stations

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Vibration Isolation Platform

All manual systems includes vibration absorbing base to achieve stable and reliable long-term probe to pad contact which ensures reliable measurement results. Vibration isolation platform or table are optional available where the laboratory environment requires extensive vibration protection.

EMI-shielded and light-tight test environment for ultra-low noise DC measurements.

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Dark Box

The available Dark Box options provides an EMI-shielded and light-tight test environment for ultra-low noise DC measurements.

MPI TS150, TS200 & TS300 are open, easy to use and cost effective manual probe systems designed for precision analysis of substrates and wafers up to 150, 200 and 300mm. These systems address a wide variety of applications such as Failure AnalysiDesign Validation/IC Engineering, Wafer Level Reliability, MEMS, High Power and Device Characterization and Modeling.

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