元件特性描述
高功率
射頻及毫米波
設計驗證
失效分析
晶圓級可靠度
Silicon Photonics
MEMS Test
Signal Integrity

MPI Laser Cutter System LCS-635

The unique MPI Laser Cutter System LCS-635 is designed for accurate and reliable Failure Analysis and Design Validation applications. Variable configurations based on 1064 nm, 532 nm, 355 nm or 266 nm wavelengths provides the capability to remove several semiconductor materials and metals selectively, see below the table.

 

Features & Benefits

High Beam Quality – Low Energy Consumption

 

The MPI Laser Cutter System is based on compact Diode Pump Solid State Laser, providing high beam quality, even at 266 nm, with enhanced pulse-to-pulse stability, and these by the unsurpassed low energy consumption.

Long Lifetime – Low Maintenance

 

The LCS-635 has more than 150x times longer lifetime as other conventional available laser systems on the market, and the passive, conductive laser head cooling, which eliminates the need for water, are making the system very reliable and reducing significantly the maintenance costs.

Intuitive Operation

 

Designing the SMART Controller with intuitive, touch-screen graphical user interface, four free-defined function buttons for fast, direct access, the six user cutting recipes, are making the daily operation of the Laser Cutter System very convenient and easy.

Wavelength – Application Matrix

 

1064 nm
532 nm
355 / 266 nm
LCD Materials
ITO
Chromium
Color Filter
(Red / Green)
ITO
Chromium
Color Filter
(Blue / Green)
Color Filter
(Blue / Green)
Semiconductor Materials
N/A
Silicon Dioxide
Nitride Polyimide (big cuts)
SOG Poly-silicon
Nitride
Polyimide
Metals
Gold
Aluminum
Tungsten
Gold
Aluminum
Tungsten
Gold
Aluminum

MPI Optics – Application Matrix

 

Microscope*1064 nm532 nm355 nm266 nm
FS70LYesYesYesNot Recommended
FS70L4Not RecommendedYesYesYes
PSM1000YesYesYesNot Recommended
VIS-200YesNot RecommendedNot RecommendedNot Recommended

* Other laser cutter compatible microscopes, on requests