MPI Introduces Unique NoiseShield™ Option for 1/f (Flicker) & RTN Measurements

Taiwan, Sept. 18th, 2019 – MPI introduced a new NoiseShield™ option, which provides excellent EMI-shielding, low impedance grounding and shortest possible cable lengths to reduce parasitic capacitance and to maximize the test system roll-off frequency. It reduces external magnetic field influences on the measurement results and makes the 1/f, RTN setup more robust and test lab location less-independent. It makes the probe station completely “invisible” and enables the measurement results down to the physical limit of the test instrumentation.

 

“The MPI NoiseShield™ is the next step in providing a high value solution for 1/f measurements.” Said Toe Naing Swe, Director Device Modeling, at MPI Advanced Semiconductor Test Division. “In combination with the MPI ShielDEnvironment™, users can now experience excellent EMI-Shielding for not only device under test (DUT) and the measurement instrument (such as pre-amplifier unit of ProPlus 9812DX), it also includes all cables and connectors. The fully integrated solution also shortens the cables by placing the LNA very close to DUT. Installed on TS3500-SE with MPI WaferWallet®, customers can now perform, for the first time ever, unsurpassed fully-automated 1/f measurements. MPI SENTIO® Software Suite includes native drivers for the ProPlus Design Solutions product suite, such as BSIMProPlus™ and NoiseProPlus™, making such automation out of the box easy.”

 

“The MPI prober is excellent and best I have ever worked with”, said Dr. Zhihong Liu, CEO and Co-Founder of ProPlus Design Solutions Inc. “For noise measurement, it gives the best performance both in shielding and reduction in parasitics. With it, we are able to reach the limit of our system without trade-offs. Using the High Precision LNA in 9812DX, we can get to the floor noise of 3e-27 A^2/Hz with >20KHz bandwidth and accurately monitor the bias current down to pA level simultaneously. It can also measure down to 0.1Hz in the low frequency end without the introduction of mechanical vibration. Using the MPI prober, we also measured a MOSFET with 10MHz on-wafer bandwidth and the noise level is reaching to our Wideband LNA noise floor.”

 

About MPI Corporation

Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI’s four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross pollination of divisional product technologies stimulates MPI product innovations that are meaningful to our precious customer base.

 

For more information please visit: www.mpi-corporation.com

 

About ProPlus Design Solutions

ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. As the leading provider of nano-scale SPICE modeling, the innovative giga-scale SPICE simulation and design for yield (DFY) applications, it provides the industry’s golden SPICE modeling platform, the first and only GigaSpice simulator, and the only integrated DFY design platform. Founded in 2006, ProPlus Design Solutions has R&D centers in the San Jose, Calif., Beijing and Jinan, China, and offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China.

 

For more information, please visit: www.proplussolutions.com

Qualcomm Builds 5G Ecosystem in Taiwan Enabling Taiwan Supply Chain Access to 5G Economic Benefits

Qualcomm Builds 5G Ecosystem in Taiwan Enabling Taiwan Supply Chain Access to 5G Economic Benefits

Roawen Chen, Qualcomm’s Senior Vice President of Manufacturing Technology and Operations.
(Image Source: Qualcomm)

 

The American enterprise Qualcomm held a groundbreaking ceremony for their new building on June 27th, 2019. The 5G technical laboratory officially launched its strategic planning in Taiwan to bolster the overall technical strength of Qualcomm in Taiwan. This effort will surely strengthen Qualcomm’s cooperation with Taiwan’s supply chain. It is expected that Qualcomm’s 5G business will experience rapid growth also benefiting the participating partners.

 

Chi-mai Chen, Vice Premier of the Executive Yuan, Yu-chin Hsu, Deputy Minister of the Ministry of Science and Technology, Chuan-neng Lin, Vice Minister of Ministry of Economic Affairs, and Mei-ying Huang, Chairperson of the Fair Trade Commission participated in the event. It is understood that Qualcomm spent a total of NT $5.5 billion to build the new structure, having an area of more than 7,270 square meters. Construction of the new building will be completed within two years, and is expected to be hold more than 1,000 employees.

 

In addition, Qualcomm’s Center for Operations, Manufacturing Engineering and Testing in Taiwan (COMET), the 5G Testing Laboratory, the Multimedia R&D Center, and the Mobile Artificial Intelligence Innovation Center will all be stationed in the new building. This is the first time that Qualcomm has constructed a new facility of this magnitude overseas without requiring rental space.

 

Roawen Chen, Senior Vice President of Manufacturing Technology and Operations of Qualcomm indicated that the construction of a new building in Taiwan’s Hsinchu Science Park means that the collaboration between Qualcomm and Taiwan’s ICT (information and communications technology) industry has marked a new milestone. S.T. Liew, Taiwan and South East Asia President of Qualcomm stated, “Qualcomm is devoted to working closely with Taiwanese industry in capturing global business opportunities. The company will continue to support the rapid development of Taiwan’s wireless communication and semiconductor ecosystem.” 

 

It is also the first time for Qualcomm to showcase its 5G laboratory in Taiwan, including 5G radio frequency (RF) IC testing, 5G module lab, biometric recognition sensing advance center and millimeter wave advance center. The equipment of these labs and centers was installed in the new building during 1H19. It is expected that more than 100 engineers will be recruited, and the scale of Qualcomm’s Taiwan 5G laboratory will continue to expand.

 

The Hsinchu Science Park’s supply chain includes IC design houses, wafer foundry and testing, etc. Once in full swing, Qualcomm’s 5G efforts is expected to increase the orders for Taiwanese vendors.   

 

As for the specific systems, besides purchasing test equipment from overseas vendors such as ADVANTEST, Qualcomm’s 5G Lab has also includes systems from MPI Corporation’s Advanced Semiconductor Test (AST) division. The lab is mainly for the testing of power amplifier (PA) chipsets with revenue benefits for all participants within Qualcomm’s 5G ecosystem.

 

Note: This press release is translated to English by MPI Corporation.

News Source: https://www.chinatimes.com/newspapers/20190628000234-260202?chdtv

MPI Announced TITAN™ Multi-Contact Probe for RF IC Characterization

Taiwan, May 2nd, 2019 – MPI Corporation introduces the TITAN™ Multi-Contact Probe, the further advances of company’s TITAN™ RF probing technology for challenges of testing modern Si RF ICs.

 

TITAN™ Multi-Contact Probe allows customers to configure up to 15 probe channels for RF, bias and logic IC terminals featuring company’s proprietary MEMS contact tip with the one of a kind contact point visibility. It offers the unique combination of the contact width of 20 μm with the smallest probe pitch starting from 50 μm, and the longest lifespan of over 1 million touchdown cycles on Al pads.

 

TITAN™ Multi-Contact Probe was designed to reduce the cost of test of modern silicon highly-integrated RF ICs by probing on small pads and providing the longest lifespan, affordable price and short lead time”, says Andrej Rumiantsev, Director of RF Technologies of MPI Corporation’s Advanced Semiconductor Division. “Being the shortest probe of its kind, it enables over-temperature characterization of large ICs in shielded environment over a wide temperature range and, at the same time, it is the most convenient probe to use.”

 

The TITAN™ Multi-Contact Probe is another example of how MPI engineers help customers solve challenges of rapidly developing and highly-competitive RF IC market.

 

About MPI Corporation

Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI’s four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross pollination of divisional product technologies stimulates MPI product innovations that are meaningful to our precious customer base.

For more information please visit: www.mpi-corporation.com

MPI Corporation Introduces New 300 mm Fully-Automatic TS3500 Wafer Probe Systems Series with WaferWallet™

Taiwan, Nov. 5th, 2018 – MPI Corporation introduces a new 300 mm fully-automatic TS3500 wafer probe systems series with WaferWallet™.

Over the past decade, the semiconductor industry has been challenged with increasing demands for accurate on-wafer measurements for Device Characterization  during the Modeling and New Technology Development processes. Current 300 mm solutions compromise on either measurement accuracy or automation capabilities. Overcoming these challenges, MPI now introduces the TS3500 probe station series configurable with unique MPI WaferWallet™ making it the most advanced fully-automatic system on the market. The combined capabilities now offer the customer unequaled measurement flexibility with test automation while significantly reducing the overall cost of test. MPI’s WaferWallet™ also incorporates simple and convenient handling of multiple wafer types and sizes.

Common practice for Device Characterization in the Modeling and New Technology Development processes is to extract data from a typical few wafers via extremely accurate IV-CV, 1/f, RF, mmW, and Load-Pull measurements. MPI’s WaferWallet™ extends the TS3500 series automation without compromising measurement capability. The WaferWallet™ is designed with five individual trays for manual, ergonomic loading of 150, 200, or 300 mm “modeling” wafers. Fully-Automated tests with up to five identical wafers at different temperatures are now possible.

“The TS3500 and TS3500-SE are equivalent in features to MPI’s well-known and established TS3000 and TS3000-SE 300 mm probe stations with the added fully-automated capability by configuring or upgrading with MPI’s unique WaferWallet™.” Says Stojan Kanev, General Manager of MPI Corporation’s Advanced Semiconductor Division. “MPI’s solution is lowering the customer’s overall cost-of-test by providing full automation for less than other vendor’s semi-automated products.”

The WaferWallet™ concept is another example of MPI leading the market by listening carefully to customer requirements and quickly turning ideas into valuable solutions.

 

About MPI Corporation

Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI’s four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross pollination of divisional product technologies stimulates MPI product innovations that are meaningful to our precious customer base.

For more information please visit: www.mpi-corporation.com

ProPlus and MPI Corporation Establish Strategic Partnership, Announce Availability of a Characterization and Modeling Solution

Cross-Licensing Agreement Brings Next-Level Wafer-Level Noise Characterization,
Enabling High Throughput Measurements with Advanced Probing Technologies 

Taiwan, Dec. 12th, 2017 – ProPlus Design Solutions Inc. and MPI Corporation today announced a strategic partnership agreement and immediate availability of a characterization and modeling solution that integrates ProPlus’ SPICE modeling and noise characterization solution with MPI’s advanced probing technologies. The integrated solution offers seamless support of the MPI probe stations to perform automated measurement of DC, CV and noise characteristics, enabling MPI users easy access to the most accurate ProPlus SPICE modeling and noise characterization offerings. The advanced probing technologies developed by MPI are optimized for the latest ProPlus 9812DX noise analyzer with improved grounding and shielding technologies critical to wafer-level noise characterization.

Under the partnership agreement, ProPlus users are able to integrate MPI’s advanced semi-automatic probe stations in their characterization and modeling flow for better noise measurement quality. The close collaboration also proved that probe card wafer-level noise characterization is possible using the 9812DX noise analyzer. Previously, these measurements were performed using manipulators and easily introducing RF interferences and oscillations. The advanced probe card technology specially developed for noise measurement provides better data quality and stability, as well as improves flexibility of wafer-level noise characterization for higher throughput.

“ProPlus Design Solutions continues to invest on improving the technologies that made wafer-level noise characterization possible 20 years ago,” remarks Dr. Zhihong Liu, chairman and chief executive officer of ProPlus Design Solutions. “We brought it to the next level with a specially designed probe card for a tightly integrated noise system thus delivering the fastest and most accurate noise characterization of the highest quality. We’re pleased to work with MPI on this effort.”

“The collaboration with ProPlus Design Solutions has enabled a seamlessly integrated wafer level low-frequency noise measurement capability with guaranteed system configuration and performance,” says Dr. Stojan Kanev, general manager of Advanced Semiconductor Test Division at MPI Corporation. “We now offer the most advanced high throughput noise characterization and modeling system. MPI’s exceptional shielding technology provides world class 1/f noise measurement capability. Customers may now rest assured these systems are validated to provide reliable and accurate noise measurement capability while enjoying a reduced cost of test.”

Availability and Pricing
The integrated solution has been adopted by leading semiconductor companies. ProPlus and MPI Corporation will demonstrate the joint solution globally throughout 2018. Interested users can request a demo at either ProPlus lab in San Jose, Calif., or the MPI lab in Taiwan. Pricing is available upon request.

About MPI Corporation
Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI’s four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross pollination of product technologies allows each new innovation to provide differentiation in areas that are meaningful to our precious customer base.

For more information please visit: mpi-corporation.com

About ProPlus Design Solutions
ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. As the leading provider of nano-scale SPICE modeling, the innovative giga-scale SPICE simulation and design for yield (DFY) applications, it provides the industry’s golden SPICE modeling platform, the first and only GigaSpice simulator, and the only integrated DFY design platform. Founded in 2006, ProPlus Design Solutions has R&D centers in the San Jose, Calif., Beijing and Jinan, China, and offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China.

For more information, contact:
Nanette Collins
Public Relations for ProPlus Design Solutions
(617) 437-1822
nanette@nvc.com

MPI Corporation Introduces New 300 mm PRIME™ Thermal Chuck Technology

Taiwan, Nov. 14th, 2017 – MPI Corporation has introduced a new 300 mm thermal chuck designated PRIME™ technology for wafer probe stations with full temperature range thermal testing while delivering unsurpassed performance and flexibility.

Continuing the innovative leadership within the engineering probe system market, MPI Corporation has co-developed with ERS Electronic GmbH, the leader of wafer thermal solutions, a new 300 mm thermal PRIME™ technology. Capability enhancements include the fastest transition time in the industry, unmatched electrical performance, higher application flexibility, wider thermal range and easy field upgradability. Incorporated with the Dynamic Thermal Shield (DTS) from ERS, soak times are shortened by a factor of 60%. Within the complete test cycle of -60°C to +300°C, the PRIME™ technology chucks are ready for the test. Furthermore, the DTS continuous dew point controlled environment reduces tedious maintenance requirements.

The PRIME™ technology platform not only enhances performance, but includes a multi-application modular design concept for the ultimate in flexibility. Options include a dedicated top surface for RF & mmW, singular IC probing, inert-gas atmospheric testing for Wafer Level Reliability, High Power  with 3 kV isolation,

30 µT residual ferromagnetism, and ultra-low-noise down to fA range with more application specific configurations to be released in the coming months. In parallel, the 300 mm (12”) wafer probe station can be configured  with temperature starting points of  -60°C,  -40°C, -10°C,  +20°C  or  +30°C  and at end points  of +200°C or +300°C. All of this is easily configurable to specific test requirements and budgets.

“Unsurpassed flexibility in temperature range for applications from RF, mmW, ultra-low noise, 1/f, to high power applications and combine with unique field upgrade paths, the PRIME™ technology is the most advanced thermal chuck systems on the market today. PRIME™ technology enables the users to become more effective and efficient in thermal wafer probing applications.” Says Stojan Kanev, General Manager of MPI Corporation’s Advanced Semiconductor Division. “Adjusting to the current budgets, reducing cost of test, footprint size, significant CDA consumption and soak times for the entire system is the power behind the latest customer oriented solution.”

“We have managed to leverage the core competencies of both companies, and the result is our PRIME™ technology. We believe that PRIME™ will meet the demand of the fast-growing market for high voltage and high-frequency chips” says Klemens Reitinger, CEO of ERS electronic GmbH. “Our partnership with MPI has been extremely valuable in terms of gaining better understanding of the analytical probing market and its customers’ challenges. Being able to identify the future needs of growth markets such as the IoT, electro mobility and sensors is essential to ERS, and we believe that our new PRIME™ chucks will enhance challenging IC characterization and overall enable faster development time.”

About MPI Corporation

Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI’s four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross pollination of product technologies allows each new innovation to provide differentiation in areas that are meaningful to our precious customer base.

For more information please visit: mpi-corporation.com